EBSD and BKD
Conclusions

 

 

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Trends in EBSD software
 

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Improved accuracy

    large acceptance angle => stable indexing
    sufficient number of consistent bands => reliability
    bands from several zone axes => reliabilty
    less pattern coarsening or pixel binning => precision
    dynamic correction of scan field rotation with focus (that does not affect grain orientation measurement but distorts crystal orientation maps only).

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High speed of measurement reduces demands on long-term stability of the SEM
(FastEBSD at present more than 1000 patterns/sec acquisition and 2000 orientations/sec indexing of pattern sequences).

Digital cameras enable pixel binning (combination of several pixels on the chip => increases sensitivity, reduces volume of data transfer, increases speed). A high speed of about 750 pattern/sec is presently achieved with a Gigabit Ethernet interface.

If intragranular structure is of no concern, it is sufficient to acquire the orientation of each grain only once, and iterative mesh refinement has proven very effective by concentrating measurement along grain boundaries. Mesh refinement is inadequate if the microstructure contains twinned grains or if a broad grain size distribution is present.
R.A. Schwarzer, Microscopy and Microanalysis 5, Suppl. 2 (1999) 242-243 .

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Low crystal symmetry is still a challenge.

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Fast phase discrimination has to be expanded to fast phase identification.

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Improved quantification of pattern quality parameter
=> correlation with stress, dislocation density.

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Radon transform and peak shape analysis
=> Evaluation of band intensities.

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3-D reconstruction of the microstructure at subgrain resolution by by consecutive sectioning.
An excellent depth resolution is achieved with a dual-beam SEM which is a conventional SEM attached with an additional FIB (field ion beam source) column for in-situ surface sputtering.

    


Home

History

Basics

TKD& EBSD

Pattern Solving

FastEBSD

Imaging Detector

Applications

Publications

Downloads

Glossary